• Technology


Cam and artwork

In this department, customer's design files are checked, validated and prepared for production.

The files generated here are: the silverfilms for dryfilm and soldermask exposure (top and bottom, innerlayer), dryfilm and solder mask LDI (laser direct imaging), drilling, routing, scoring, legend print, carbon print.


After the base materials are cut to a standard panel dimension (430x580 mm), they are packed into a packing together with aluminium and wooden bottom panel and are prepared for the drilling.

We use world-renowed, German Schmoll drilling machines equiped with auto-loader, CCD camera system, X-ray functionality, CBD, laser length mesuring system with repeated accuracy down to 25um.

Direct metallization and laminating

In this chemistry process known as „BlackHole“ from MacDermid, a think film of carbon is applied to a wall of holes that are drilled in the previous process. This process enables the copper to be applied into in Electroplatting process and makes possible to connect top and bottom side (or innerlayer) of the boards, also known as PTH (plated-through-holes).

In line with the blackhole line is the laminator, which sticks the dryfilm onto the surfaces of the board.

Dryfilm exposure and development

Depending on the requested quantity and technology requirements, the artwork is applied into the laminted boards either with high power mercury lamp exposure or LDI (laser direct imaging). The board then goes to the develop line where unexposured dryfilm areas are removed.


In this process, the copper layer is applied (25um-100um) to a board surface and backhole activated holes. We currently use there different technologies in producing PCB depending on customer requirements (minimum line space and aspect-ratio): panel-plate, pattern-plate and semi pattern plate.

In the last baths, the thin layer of tin is also applied, which covers artwork copper and protects copper to be etched away in the alcaline etch line.


In this line, first the dryfilm is being removed, then excess copper that is not previously covered with tin protection layer is also remove, and the tin protection layer is stripped away from the board. As a result, the board with the designed tracks and PTH is generated.

Soldermask, legend and carbon print

First, the board is being chemicaly threated to clean and prepare the surfaces for the soldermask. This line is called MEC (Japany based world-renowed supplier of microech chemistry). Then the soldermask is applied on the surface either with the screen printing or with a curtain-coater machine and the to predrying. The board is then sent to exposure and development process and then is finally curried. As a result, a board with soldermask protection, and/or legend and/or carbon layer is made.

HAL (Hot air leveling)

In this process, the board is first cleaned and prepared, then flux is being applied to a board, and then is being sunked into liquefied leadfree tin. As a result, a board with the protective layer of tin is made. This ensures the shelves life of minumum 6 months and good solderability of the board in the next processes (wave soldering, slective soldering, SMT, etc).


The board is placed into a machine, in which previously the testing program is generated based upon the customer design files, and each track/net is being tested for connectivity, minimum resistance, voltage, etc. This ensures that the board is 100% complient to the customer requirements.

Routing and Scoring (V-Cut)

The single boards or panels are being cut to desired dimensions and tolerances.

Final clean and final inspection

All single boards and panels are manualy inspected for any additional errors.

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